9icnet provides you with 658-25ABT4E designed and produced by Wakefield-Vette, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. 658-25ABT4E price reference $2.39000. Wakefield-Vette 658-25ABT4E Package/Specification: HEATSINK CPU 28MM SQ BLK W/TAPE. You can download 658-25ABT4E english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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The 658-25ABT4 is HEATSINK CPU 28MM SQ BLK W/TAPE, that includes Black Color, they are designed to operate with a Aluminum Material, Series is shown on datasheet note for use in a 658, that offers Product features such as Heat Sinks, Type is designed to work in Top Mount, as well as the SMD/SMT Mounting Style, the device can also be used as 6.35 mm Height. In addition, the Length is 1.100" (27.94mm), the device is offered in 1.100" (27.94mm) Width, the device has a Square, Pin Fins of Shape, and Package Cooled is BGA, and the Attachment Method is Thermal Tape, Adhesive (Included), and Height Off Base Height of Fin is 0.250" (6.35mm), and the Power Dissipation Temperature Rise is 2W @ 40°C, and Thermal Resistance Forced Air Flow is 5°C/W @ 500 LFM, and the Material Finish is Black Anodized, and Designed for is BGA Super BGA PBGA FPBGA PowerPC, and the Heatsink Material is Aluminum, and Fin Style is Omnidirectional Fin.
The 658-25ABT2 is HEATSINK CPU 28MM SQ BLK W/TAPE, that includes 1.100" (27.94mm) Width, they are designed to operate with a Top Mount Type, Thermal Resistance Forced Air Flow is shown on datasheet note for use in a 5°C/W @ 500 LFM, that offers Shape features such as Square, Pin Fins, Series is designed to work in 658, as well as the 2W @ 40°C Power Dissipation Temperature Rise, the device can also be used as BGA Package Cooled. In addition, the Material Finish is Black Anodized, the device is offered in Aluminum Material, the device has a 1.100" (27.94mm) of Length, and Height Off Base Height of Fin is 0.250" (6.35mm), and the Attachment Method is Thermal Tape, Adhesive (Included).
The 658-25ABT3 is HEATSINK CPU 28MM SQ BLK W/TAPE, that includes Thermal Tape, Adhesive (Included) Attachment Method, they are designed to operate with a 0.250" (6.35mm) Height Off Base Height of Fin, Length is shown on datasheet note for use in a 1.100" (27.94mm), that offers Material features such as Aluminum, Material Finish is designed to work in Black Anodized, as well as the BGA Package Cooled, the device can also be used as 2W @ 40°C Power Dissipation Temperature Rise. In addition, the Series is 658, the device is offered in Square, Pin Fins Shape, the device has a 5°C/W @ 500 LFM of Thermal Resistance Forced Air Flow, and Type is Top Mount, and the Width is 1.100" (27.94mm).